Heat Bed Power Module Expansion Hot Bed
Heated bed power module
Based on powerful MOSFET
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working
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